IEC - International Electrotechnical Commission - IEC 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 8 January 2015 |
| Status: | published |
| Page Count: | 83 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for... View More
Document History
IEC 61189-5-2:2015
January 8, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for...