IEC - International Electrotechnical Commission - IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 7 May 2014 |
| Status: | published |
| Page Count: | 187 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing... View More
Document History
IEC TR 62866:2014
May 7, 2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in...