IEC - International Electrotechnical Commission - IEC 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 29 April 2015 |
| Status: | published |
| Page Count: | 44 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave... View More
Document History
IEC 61189-2-721:2015
April 29, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies...