IEC - International Electrotechnical Commission - IEC 62047-15:2015
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 5 March 2015 |
| Status: | withdrawn |
| Page Count: | 21 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices... View More
Document History
IEC 62047-15:2015
March 5, 2015
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices...