IEC - International Electrotechnical Commission - IEC 61249-8-8:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 24 June 1997
Status: published
Page Count: 19
ICS Code (Printed circuits and boards): 31.180
abstract:

Provides requirements for the qualification of temporary solder resist coatings.

Requirements stated in this specification will also have some limited validity for assessing the suitability... View More

Document History

IEC 61249-8-8:1997
June 24, 1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of...
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