IEC - International Electrotechnical Commission - IEC 61249-5-1:1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 28 November 1995
Status: published
Page Count: 39
ICS Code (Printed circuits and boards): 31.180
abstract:

Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed... View More

Document History

IEC 61249-5-1:1995
November 28, 1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.
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