IEC - International Electrotechnical Commission - IEC 62047-26:2016

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 7 January 2016
Status: published
Page Count: 57
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For... View More

Document History

IEC 62047-26:2016
January 7, 2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For...
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