IEC - International Electrotechnical Commission - IEC 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 5 January 2016 |
| Status: | published |
| Page Count: | 22 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under... View More
Document History
IEC 61189-3-719:2016
January 5, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical...