IEC - International Electrotechnical Commission - IEC 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 29 August 2006 |
| Status: | published |
| Page Count: | 62 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
Document History
IEC 61189-5:2006
August 29, 2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.