IEC - International Electrotechnical Commission - IEC 60749-35:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 18 July 2006
Status: published
Page Count: 43
ICS Code (Semiconductor devices in general): 31.080.01
abstract:

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination,... View More

Document History

IEC 60749-35:2006
July 18, 2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination,...
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