IEC - International Electrotechnical Commission - IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 18 July 2006 |
| Status: | published |
| Page Count: | 43 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination,... View More
Document History
IEC 60749-35:2006
July 18, 2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination,...