IEC - International Electrotechnical Commission - IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 May 2017 |
| Status: | published |
| Page Count: | 23 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a... View More
Document History
IEC 61189-5-503:2017
May 22, 2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity...