IEC - International Electrotechnical Commission - IEC 61249-4-1:2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 January 2008 |
| Status: | published |
| Page Count: | 12 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61249-4-1:2008 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing... View More
Document History
IEC 61249-4-1:2008
January 30, 2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
IEC 61249-4-1:2008 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing...