IEC - International Electrotechnical Commission - IEC 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 11 July 2007 |
| Status: | published |
| Page Count: | 15 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between... View More
Document History
IEC 62137-1-1:2007
July 11, 2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between...