IEC - International Electrotechnical Commission - IEC 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 26 January 2009 |
| Status: | published |
| Page Count: | 25 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder... View More
Document History
IEC 62137-1-4:2009
January 26, 2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder...