IEC - International Electrotechnical Commission - IEC 60749-20-1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 7 April 2009 |
| Status: | revised |
| Page Count: | 63 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD... View More
Document History
June 26, 2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 60749-20-1:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to...
June 26, 2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 60749-20-1:2019 is available as IEC 60749-20-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous...
IEC 60749-20-1:2009
April 7, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD...