IEC - International Electrotechnical Commission - IEC 62137-1-3:2008
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 27 November 2008 |
| Status: | published |
| Page Count: | 46 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is... View More
Document History
IEC 62137-1-3:2008
November 27, 2008
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended...