IEC - International Electrotechnical Commission - IEC 60191-6-1:2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 October 2001 |
| Status: | published |
| Page Count: | 7 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
Document History
IEC 60191-6-1:2001
October 30, 2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)