IEC - International Electrotechnical Commission - IEC 60512-6-2:2002
Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 21 February 2002 |
| Status: | published |
| Page Count: | 9 |
| ICS Code (Plug-and-socket devices. Connectors): | 31.220.10 |
abstract:
Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.
Document History
IEC 60512-6-2:2002
February 21, 2002
Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.