IEC - International Electrotechnical Commission - IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 March 2001 |
| Status: | published |
| Page Count: | 12 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch... View More
Document History
IEC 60191-6-6:2001
March 22, 2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is...