IEC - International Electrotechnical Commission - IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 29 September 2000 |
| Status: | published |
| Page Count: | 17 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
Document History
IEC 60191-6-3:2000
September 29, 2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.