IEC - International Electrotechnical Commission - IEC 62047-10:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 26 July 2011
Status: published
Page Count: 22
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.... View More

Document History

February 28, 2012
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
A description is not available for this item.
IEC 62047-10:2011
July 26, 2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication....
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