IEC - International Electrotechnical Commission - IEC 60191-6-20:2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 August 2010 |
| Status: | published |
| Page Count: | 21 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
Document History
IEC 60191-6-20:2010
August 30, 2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.