IEC - International Electrotechnical Commission - IEC 60191-6-21:2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 August 2010 |
| Status: | published |
| Page Count: | 28 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Document History
IEC 60191-6-21:2010
August 30, 2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.