IEC - International Electrotechnical Commission - IEC 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 February 2003 |
| Status: | published |
| Page Count: | 11 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process... View More
Document History
November 29, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable...
July 28, 2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
A description is not available for this item.
IEC 60749-19:2003
February 13, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.