IEC - International Electrotechnical Commission - IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 12 September 2002 |
| Status: | published |
| Page Count: | 41 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.
The... View More
Document History
August 13, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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IEC 60749-22:2002
September 12, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the...