IEC - International Electrotechnical Commission - IEC 61192-4:2002
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 29 November 2002 |
| Status: | withdrawn |
| Page Count: | 59 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic... View More
Document History
IEC 61192-4:2002
November 29, 2002
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates....