IEC - International Electrotechnical Commission - IEC 60749-10:2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 9 April 2002 |
| Status: | revised |
| Page Count: | 7 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied... View More
Document History
April 27, 2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of...
August 13, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
Modification of the validity date: now put at 2007.
IEC 60749-10:2002
April 9, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied...