IEC - International Electrotechnical Commission - IEC 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 25 March 2002 |
| Status: | published |
| Page Count: | 41 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality... View More
Document History
IEC 61190-1-1:2002
March 25, 2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality...