IEC - International Electrotechnical Commission - IEC 62047-14:2012

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

published
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 28 February 2012
Status: published
Page Count: 34
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film... View More

Document History

IEC 62047-14:2012
February 28, 2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described...
Advertisement