IEC - International Electrotechnical Commission - IEC 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 28 February 2012 |
| Status: | published |
| Page Count: | 34 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film... View More
Document History
IEC 62047-14:2012
February 28, 2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described...