IEC - International Electrotechnical Commission - IEC 62047-13:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 28 February 2012 |
| Status: | published |
| Page Count: | 30 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to... View More
Document History
IEC 62047-13:2012
February 28, 2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive...