IEC - International Electrotechnical Commission - IEC 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 7 September 2011 |
| Status: | published |
| Page Count: | 76 |
| ICS Code (Environmental testing): | 19.040 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these... View More
Document History
IEC 60068-2-83:2011
September 7, 2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these...