IEC - International Electrotechnical Commission - IEC 62047-12:2011

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 13 September 2011
Status: published
Page Count: 59
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines.... View More

Document History

IEC 62047-12:2011
September 13, 2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This...
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