IEC - International Electrotechnical Commission - IEC 62047-12:2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 September 2011 |
| Status: | published |
| Page Count: | 59 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechan
Document History
IEC 62047-12:2011
September 13, 2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This...