IEC - International Electrotechnical Commission - IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 7 August 2003 |
| Status: | published |
| Page Count: | 27 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part... View More
Document History
IEC 60749-14:2003
August 7, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for...