IEC - International Electrotechnical Commission - IEC 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 10 February 1999 |
| Status: | published |
| Page Count: | 14 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring.
Films coated on... View More
Document History
IEC 61249-3-4:1999
February 10, 1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
Gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring. Films coated on only one...