IEC - International Electrotechnical Commission - IEC 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 10 February 1999 |
| Status: | published |
| Page Count: | 12 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
Document History
IEC 61249-3-5:1999
February 10, 1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.