IEC - International Electrotechnical Commission - IEC 60249-3-3:1991
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 4 June 1991 |
| Status: | withdrawn |
| Page Count: | 37 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed... View More
Document History
IEC 60249-3-3:1991
June 4, 1991
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed...