IEC - International Electrotechnical Commission - IEC PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 May 2007 |
| Status: | withdrawn |
| Page Count: | 31 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
Document History
IEC PAS 61249-3-1:2007
May 30, 2007
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types