IEC - International Electrotechnical Commission - IEC PAS 62185:2000
Thermal shock test method
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 August 2000 |
| Status: | replaced |
| Page Count: | 7 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.
Document History
IEC PAS 62185:2000
August 22, 2000
Thermal shock test method
This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.