IEC - International Electrotechnical Commission - IEC PAS 62174:2000
Resistance to soldering temperature for through-hole mounted devices
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 August 2000 |
| Status: | replaced |
| Page Count: | 5 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into... View More
Document History
IEC PAS 62174:2000
August 22, 2000
Resistance to soldering temperature for through-hole mounted devices
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the...