IEC - International Electrotechnical Commission - IEC 60249-3-1:1981
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 1 January 1981 |
| Status: | withdrawn |
| Page Count: | 20 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.
Document History
IEC 60249-3-1:1981
January 1, 1981
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.