IEC - International Electrotechnical Commission - IEC PAS 62213:2001
Specification and characterization methods for nonwoven para-aramid reinforcement
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 February 2001 |
| Status: | withdrawn |
| Page Count: | 16 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and electronic applications.... View More
Document History
IEC PAS 62213:2001
February 13, 2001
Specification and characterization methods for nonwoven para-aramid reinforcement
Covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and electronic applications....