IEC - International Electrotechnical Commission - IEC 60191-3A:1976
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
revised
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 1 January 1976 |
| Status: | revised |
| Page Count: | 11 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
| ICS Code (Mechanical engineering drawings): | 01.100.20 |
abstract:
Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.
Document History
IEC 60191-3A:1976
January 1, 1976
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.