IEC - International Electrotechnical Commission - IEC 61300-2-47:2004
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 23 June 2004 |
| Status: | revised |
| Page Count: | 15 |
| ICS Code (Fibre optic interconnecting devices): | 33.180.20 |
abstract:
Details a procedure for determining the suitability of a fibre optic device to withstand the effects of thermal shock.
Document History
May 19, 2016
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks
IEC 61300-2-47:2016 details a procedure for determining the suitability of a fibre optic device to withstand the effects of thermal shock. In practice, this means a very short change over time...
April 21, 2011
Corrigendum 1 - Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks
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October 11, 2010
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks
IEC 61300-2-47:2010 details a procedure for determining the suitability of a fibre optic device to withstand the effects of thermal shock. In practice this means a very short change over time between...
September 27, 2006
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks
This part of IEC 61300 details a procedure for determining the suitability of a fibre optic device to withstand the effects of thermal shock. In practice this means a very short change over time...
IEC 61300-2-47:2004
June 23, 2004
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks
Details a procedure for determining the suitability of a fibre optic device to withstand the effects of thermal shock.