IEEE - Institute of Electrical and Electronics Engineers, Inc. - Power distribution fidelity of wirebond compared to flip chip devices in grid array packages

Author(s): H. Hashemi ; D.J. Herrell
Sponsor(s): IEEE Comput. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 1997
Volume: 20
Page Count: 7
Page(s): 272 - 278
ISSN (Paper): 1070-9894
DOI: 10.1109/96.618227
Regular:

We have simulated the power fidelity of wirebond and flip chip grid array packages suitable for next generation microprocessors. The dc power droop across the chip from resistive losses and the ac... View More

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