IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influence mechanism of pad type on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint

2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS)

Author(s): Xin Wang ; Xunping Li ; Kailin Pan ; Bin Zhou ; Tingbiao Jiang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2014
Conference Location: Guangzhou, China
Conference Date: 6 August 2014
Page(s): 694 - 697
ISBN (CD): 978-1-4799-6631-8
ISBN (Electronic): 978-1-4799-6632-5
DOI: 10.1109/ICRMS.2014.7107287
Regular:

The influence mechanism of different pad types (SMD and NSMD) on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated by experiment and Finite Element Analysis (FEA) method. The... View More

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