IEEE - Institute of Electrical and Electronics Engineers, Inc. - Predictive modeling of pattern-dependent etch effects in large-area fully-integrated 3D virtual fabrication

2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Author(s): D. Fried ; K. Greiner ; D. Faken ; M. Kamon ; A. Pap ; R. Patz ; M. Stock ; J. Lehto ; S. Breit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2014
Conference Location: Yokohama, Japan
Conference Date: 9 September 2014
Page(s): 209 - 212
ISBN (CD): 978-1-4799-5285-4
ISBN (Electronic): 978-1-4799-5288-5
ISBN (DVD): 978-1-4799-5286-1
ISBN (Paper): 978-1-4799-5287-8
ISSN (Paper): 1946-1569
DOI: 10.1109/SISPAD.2014.6931600
Regular:

We present a predictive modeling approach for pattern-dependent etch processes implemented in a 3D virtual fabrication software platform. This technique combines long-range effects using design... View More

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