IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electromechanical transient modeling of modular multilevel converter based multi-terminal HVDC systems

2014 IEEE PES General Meeting: Conference & Exposition

Author(s): Sheng Liu ; Zheng Xu ; Wen Hua ; Geng Tang ; Yinglin Xue
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2014
Conference Location: National Harbor, MD, USA
Conference Date: 27 July 2014
Page(s): 1
ISBN (Electronic): 978-1-4799-6415-4
DOI: 10.1109/PESGM.2014.6938791
Regular:

Summary form only given. This paper studies the techniques for modeling modular multilevel converter (MMC) based multi-terminal HVDC (MTDC) systems in the electromechanical transient mode.... View More

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