IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of polyimide processing on multichip glass ceramic module fabrications

Author(s): Da-Yuan Shih
Sponsor(s): ESD Assoc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 1996
Volume: 19
Page Count: 11
Page(s): 315 - 325
ISSN (Paper): 1083-4400
DOI: 10.1109/3476.558561
Regular:

This paper discusses the yield analysis of the thin film wiring layers fabricated on the 127 mm multichip glass ceramic modules (MCM-D), currently used on the IBM Enterprise System/9000 family of... View More

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