IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dense 3D-packing algorithm for filling the offset contours of a new printing process based on 3D plastic droplet generation

2013 IEEE International Conference on Robotics and Biomimetics (ROBIO)

Author(s): Jelena Prsa ; Johannes Schwaiger ; Franz Irlinger ; Tim C. Lueth
Sponsor(s): IEEE Robot. Autom. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2013
Conference Location: Shenzhen, China
Conference Date: 12 December 2013
Page(s): 74 - 78
ISBN (Electronic): 978-1-4799-2744-9
DOI: 10.1109/ROBIO.2013.6739438
Regular:

In this paper a new slicing method for filling an arbitrary polygon with 3D-balls for a 3D plastic droplet generation process is presented. The work principle of the 3D plastic droplet generation... View More

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