IEEE - Institute of Electrical and Electronics Engineers, Inc. - On Through Silicon Vias as used in three dimensional integrated circuits

2013 Fourth Annual International Conference on Energy Aware Computing Systems and Applications (ICEAC)

Author(s): Robert Minvielle ; Magdy Bayoumi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2013
Conference Location: Istanbul, Turkey
Conference Date: 16 December 2013
Page(s): 125 - 130
ISBN (Electronic): 978-1-4799-2543-8
DOI: 10.1109/ICEAC.2013.6737650
Regular:

This paper presents a survey of 3D Integrated Circuits using Through Silicon Vias (TSV). 3D Integrated Circuits and the TSV will be defined, the rationale for moving to these systems will be... View More

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